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| SHARP ELECTRONIC COMPONENTS GROUP SHARP CORPORATIO SPECIFICATION / OlT'O-ELECI'RONIC Applied model name D DEVICE SPECIFICATION FOR VOLTAGE MODEL No. REGIJIX-OR PQ***EZO 12 1. These spectication sheets include materials protected Please do not reproduce or cause anyone to reproduce under copyright of Sharp Corporation them without Sharp's consent. Wharp"). 2. When using this product, please observe the absolute maximum ratings and the instructtons for use outlined in these specitkation sheets, as well as the precautions mentioned below. Sharp assumes no responsibthty for any damage resulting from use of the product which does not comply with the absolute mardmum ratings and the instructions included in these speciflcatton sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas : Home appliances OA equipment . Audio visual equipment Measuring equipment * TelecommuntcaUon equipment (Terminal) Computers [ Tooling machines l l l l l If the use of the product tn the above application areas is for equipment h&d in paragraphs (2) or [3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment whtch demands htgh relfabtltty and safety in functfon and precision, such as : l l 1 [ l Transportation control and safety equipment (atrcraft, tram, automobile etc.) Gas leakage sensor breakers Rescue and securlly equipment Other safety equipment Traffic signals l l 1 13) Please do not use this product for equipment which require extremely high relfabthty . and safety in function and precision. such as : i, TelecommunicaUon equipment (for trunk lines> * Space equipment * Medical equipment [ * Nuclear power control equipment l 1 (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER'S APPROVAL DATE PRESENTED BY K. Hachimura, Department General Manager Engineering Dept..11 Opto-Electronic Devices Div. DATE BY of ELECOM Group SHARP CORPORATION SHARP CORPORATION 1. AppIication This specification appkes to the outbne and characteristics of tape packing type series regulator (linear type), Model No. PQ***EZOlZ. AppIied Model name PQO15EZOlZZ. PQO15EZOlZP. usage PQ++*EZOlZ are the device for stabikzation of DC positive output voltage with built-in ON/OFF function, the over current protection function, the overheat protection function and low consumpUon current at OFF-state (stand-by). These devices are possible to use in power supply circuit up to current capacity IA. Block diagram .. . ..-..______....1.-.-...- PQO18EZOlZZ. PQO18EZOlZP, PQO25EZOlZZ. PQO25EZOlZP, PQO3OEZOlZZ. PQO3OEZOlZP, PQO33EzolZZ PQO33EZOlZP DC input 0 ( DC output (`Vo) , ON/OFF . . . ..~~~~.I GND control (`Vcl 2. Outline : Refer to the attached sheet, Page 3. 3. Ratings and characteristics maximum : Refer to the attached ratings sheet, Page 4 to 7. 3.1 Absolute 3.2 Electrical 3.3 Electrical 3.4 Pd-Ta 4. ReIiability 5. Outgoing a characteristics characterisUcs (Typical measuring circuit (, i rating valuel sheet, Page 8.9. sheet, Page 9. : Refer to the attached inspection : Refer to the attached SHRRP CORPORATION 6. Supplement 6.1 Example : Refer to the attached of application and reel packaging (PQ***EZO sheet, Page 10 to 15. 6.2 Taping 6.3 (PQ***EZOlZP) 122) Sleeve packaging 6.4 ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials for ODS : CFC,. Halon. Carbon 1.1.1 -`Mchloroethane tetrachloride, (Methylchloroform process 6.5 Brominated flame retardants such as the PBBOs and PBB, are not used Specitk brominated flame retardants in this device at all. 6.6 This product is not designed as electromagnetic and ionized-particle radiation resistant. 7. Notes : Refer to the attached 7.1 External 7.2 Thermal 7.3 Static connection protection electricity design sheet, Page 16 to 18. 7.4 Soldering 7.5 For cleaning I (. SHARP CORPORATlON 2. Outline . 6.6 i'4AX 52~0.5 I I ;,!. _." / Model No.% / Lot /(DIN No. standard) 2.3to.s /- I -#I I . (. i I I V~ Applied model No. PQO15EZOlZZ PQ018E20122 WO25EzO1ZZ W030EZOlZZ P6033EZOlZZ Pii015E20127 PQ018EzOIzz PQ025EZO 1 ZZ PQO3OEzO 1ZZ x33E7fi 172 PQC----_-- 1 I Marked model No. 015EZO1 018EzOl 025EZO 1 030E: zol 033EZOl Ol! SE20 1 018EZ01 025EZO I 030EZO I 033EZOl --~~ I I t 1 t 1 1 I 0 @I 0 @I (3 DC input (Vinl ON/OFF control DC output (Vo) NC GND (Vc) *( ) :TYP. Unit : mm -Scale: 5/l l . I I 1 I 12) l l Lead finish : Solder plating Lead material : Cu - Product mass : 0.3g % (Example of the marking in case of the PQ***EZO SHARP CORPORflTION 3. Ratings and characteristics maximum ratings Ta=25C Parameter Symbol Vin VC 3.1 Absolute R-x! 10 10 unit V V Conditions Input Output (`1) Output voltage control (`1) voltage current (*2) (*3) 10 Pd T1 Topr Tstg Tsol 1 8 150 -40 to +85 -40 to +150 260 A W c c c c For 10 s Refer to Fig. 1 Power dissipation Junction Operating Storage Soldering temperature temperature temperature temperature (+l) All are open except GND and applicable terminals. (*2) Pd : With infinite heat sink (*3) There is case that over heat protection operates at the condition Tj= 125% to 15OC Fig. I Pd - Ta rating 10 8 i Power dissipation Pd WI Ambient temperature Ta (C) function operates at oblique Pd : With infinite heat sink (Note) There is case that over heat protection line portion. SHRRP CORPORATION 3.2 EIectrlcal characteristics Unless otherwise specified condition shall be Wn=Vo(TYP)+lV. Io=O.SmA. Vc=2.7V. Ta=25'c Parameter Input voltage Output voltage Load regulation Line regulation Temperature coefacient of output voltage Ripple rejection Dropout voltage On-state voltage for control On-state current for control Off-state voltage for control Off-state current for control Quiescent current Output off-state consumption current Symbol ViIl vo RegL RegI TcVo RR vi-o Vc (on) Ic (on) Vc (ofi) Ic (off) h Iqs 45 2.0 MIN. 2.35 TYP. MAX. 10 unit v V % ow-v %/C dl3 v V PA V PA mA a PA vc=o.4v Io=OA Io=OA vc=o,4v 10=5mA to 1A vin=vo(TYP)+ 1v to Vo(TYP)+6v 10=5mA Io=SmA Tj=O to 125C Refer to Fig.3 (`5). 10=0.5A Conditions Refer to list 1 0.2 0.1 fO.01 60 0.2 1 2.0 1.0. 0.5 200 0.8 2 2 5 (*4) Applied to PQO30EZOlZ and PQO33EZOlZ. (`5) Input voltage when output voltage falls 0.95Vo by input voltage falling down, (+6) In case that the control terminal (0 pin) is non-connection, output voltage should be OFF state. List 1 Output voltage SHflRP CORPORATION 3.3 Electrical characteristics measuring measuring circuit circuit of Regulator portion Fig. 2 Standard Fig. 3 Standard measuring circuit of critkal rate of ripple rejection f=lZOHz sine wave ei(rms)=0.5V vin=vo(TYFq+ 1v 10=0.3A RR=20 log (ei(rms)/eo(rmsll SHflRP CORPORfiTION 3.4 Pd - Ta rating (Typical value) Power dissipation Pd WI 1 0 20 40 60 80 Ambient temperature Ta (C) (, i, Mounting PCB I Material : Glass-cloth epoxy resin Size: 5OX50X1.6mm Thickness of copper : 35 p m =-T PCB I Copper foil SHfiRP CORPOMTION The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD : 10%/20% Test Items Temperature cycung Humidity (Steady State) Test Conditions 1 cycle -4OC to +15OC (3(hninl (3Omfm 20 cycles test +6OC .9O%RH. lOOOh 1 cycle : -20C to 7OC (2hl (2h) Transfer time between high and low temp. is 1h. 40 cycles test, 9O%RH +150%. lOOOh -40-C, lOOOh Operation life Mechanical shock Vibration [variable frequency) Electrostatic discharge Soldering heat Robustness of Termination (Tensile test) Robustness of Termination (Bending test] Ta=25C, Pd=0.8W. lOOOh 15km/s*. 0.5ms 3 times/ *X *Y. *Z 200m/s2 100 to 2000 to lOOHz/4 mm 4 times/ X. Y. 2 directton -+25OV. 2OOpF. 00 Between GND and each tee/ 3 times 260%. 10 s. Dip up to 0.5mm from resin portion l l Weight: 1ON 10 s/ each terminal l2 Weight: 2.5N 0' -go= -0' --go= -0' each terminal l 3 230+5C. 5+0.5 s Userogtnflux l1 U: Upper spe&catton limit vi-o>UX1.2 `4 n=22. C=O n=ll. C=O Failure Judgement Criteria Vo Damp Heat cyclic High temp. storage Low temp. storage n=ll, C=O L: Lower n=ll. specffication i limit .' ' n=ll. n=ll, Failure if it has breakdown and loosened pin. 5 Failure if solder shall not be adhere at the area of 95% or more dipped portion. +6 ' n=ll. C=O C=O C=O C=O Solderablllty n=l1. C=O SHRRP CORPORfllION l 1 Soldering below. area is shown `2 Terminal tensile direction is shown below. O.Smm *3 Terminal bending is shown below. CI /p\ c direction Weight l 4 Applied to PQO3OEZO 12 and PQ033EZO of terminal. 12. l 5 Except for the bending 'i *6 Except for the portion within 0.5mm from the interface between the heat sink and the resin portion, and the side surface of heat sink. '! ?I 1 5. Outgoing Weight inspecti on . ; i TABLE II-A single sampling plans for normal inspection based on IS0 2859 is applied. The AQL according to the inspection items are shown below. Defect Major defect Inspection Electrical Unreadable items AQL (OhI Judgement criteria characteristics 0.1 marking Depend on the spectication Minor defect Appearance 0.4 Dimensions SHflRP CORPORATION 6. Supplement 6.1 Example of application CO+ +1 I1 47 IT High : Output or Open : Output ON OFF I \rb ON-OFF s@nal i T' i SHARP CORPORflTION 6.2 Packing 6.2.1 specifications conditions (PQ**+EZOlEP) Packing ( 1) Tape structure and Dimensions (Refer to Fig. A) The tape shall have a structure in whtch a cover tape is sealed heatpressed on the carrier tape of polystyrene emboss protect against static electricity. Dimensions are shown Fig. A (2) Reel structure and Dimensions (Refer to Fig.B) Dimensions are shown Fig. B. The reel shall be made of polystyrene. (3) Direction of product insertton (Refer to Fig. C) tape shall direct to the radiate fin of product at Product direction in carrier the hole side on the tape. 6.2.2 Tape characteristics of cover tape (1) Adhesiveness The peel-back force between carrier tape and cover tape shaU be O.lN to 0.8N for the angle from 160' to 180' . (Tape speed : 5mm/s) (2) Bending strength Sealed tape : Bended tape radius shall be more than 30mm. if bended tape radius is less than 3Omm. there is case that cover tape come off carrier tape. Carrier 6.2.3 Rolling tape : Bended method method tape radius &all be more than 15mm. and quantity (. iI (1) Rolling Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20 pitch of empty cavities to the trailer and attach more than 10 pitch of empty cavities to the leader of the tape and fix the both ends with adhesive tape. One reel shall`contain 3000 PCS. SHARP CORPORflTION 6.2.4 Indication (1) -1 The reel shall be pasted label with following l information. l Model No. case l Number of pieces contained Production date (2) Package The outer packaging l case shall be marked of pieces contained with following l information. date Model No. condition l Number Inspection 6.2.5 Storage Taped products shall be stored at the temperature lo&r than 5 to 30'6 and the humidities lower than 7O%RH. If taped products aren't used longer than for lodays, Please rewind the tape pulled out and storage. 6.2.6 Others of tape tape in one reel shall be jointless. devices (1) joint The cover tape and carrier (2) The way to repair taped failure The way to repair taped failure devices cut a bottom of carrier tape with a cutter, and after replacing to good devices, the cutting portion shall be sealed with adhesive tape. Fig. A Tape structure and Dimensions Dimensions : WP. Unit : mm value SHARP CORPORflTION Fig. B Reel structure and Dimensions Dimensions : TYP. value Unit : mm Fig. C Direction of product insertion li ;. i Pull-out direction SHARP CORPORRTION 6.3 Sleeve packaging 6.3.1 Packing (PQ'+*Eu)lZ) conditions and Dimensions (Refer to Fig. D) (1) Sleeve structure The sleeve shall be made of high inpuct polethylene (Plastics with preventing static electricity). Dimensions are shown Fig. D. (2) The packfng case shall be made of corrugated Dimensions are shown Fig. F. (3) Stopper structure rubber. cardboard. The stopper shall be made of styrene butadiene 6.3.2 Packaging method method and quantity (1) Packaging Max. 75pcs. of products shaIl be packaged in a sleeve and both of Fix the packing case by kraft tape. sleeve edges shall be fixed by stoppers. (2) Quantity (Refer to Fig. E) shall contain 3OOOpcs./package. One package 6.3.3 Indication case case shall be marked l (1) Packing The packing l with following l information. Inspection 1 (. date i1 Model No. Number of pieces contained . SHHHY CUHPUHHI IUN Fig. D GKtnnnor w"."~~r. @See ye (Without pulled potion) @Stopper (With pulled portion) 4 0 sleeves ( 1 0 IineX 4 stairs) Fig. F ():Typ. unit: mm Mass per packaged case: 1.6kg TYP Inspection date SHARP CORPORfiTION 7. Notes 7.1 External connection C-MOS or TIL (1) Please perform shortest wiring for connection between Cm, Co and the individual terminal. There is case that oscillation occurs easily by kinds of capacitor and capacity. Before you use this device, you should confirm output voltage on your use mounting state. (2) The input terminal for ON/OFF output control ; @ is compatible with IS-`ITI+ and direct driving by `ITL or C-MOS standard logic (RCA 4000 series) is also available. In case that ON/OFF terminal is not used, we recommend to connect the ON/OFF terminal dire&Q to the input terminal ; @ input voltage. (3) As voltage application under conditions that the device pin is inserted divergently or reversely, may occur the degradation of characteristics or breakdown of the device. please avoid it absolutely. 7.2 Thermal protection design (Pd) of device is obtained by the I (. i\ Internal power dissipation following equation. Pd=IoX(Vin-Vo)+VinXIq If the maximum operating temperature and Pd (MAX.) when the device is operating are determined. use such a heat sink as allows the device to operate within the safety operation area specified by the derating curve in para. 3.4. Insufhcient radiation gives an unfavorable infIuence to the normal operation and reliabihty of the device. In the case of no passage within the safety operational territory fflustrated by the derating curve, the overheat protectton circuit operates to let output fall down, please avoid keeping such condition for a long time. SHARP CORPORATION 7.3 Static electricity Good caution must be exercised against static electricity since this device consists of a bipolar IC. Following are some examples of preventive measures against excessive voltages such as caused by static electricity. (al frytibody . (b) Anything inserter, that is in contact with the device such as workbench, or measuring instrument must be grounded. must be grounded to discharge the static electricity from the body (cl Use a solder dip basin with a minimum leak current (isolation resistance 10MQ or more] from the commercial power supply. Also the solder dip basin must be grounded. 7.4 Soldering (1) Reflow soldering It is and (The It is room recommended that within two times soldering be done at the temperature the time within the temperature profile as shown in the figure. temperature shown in the figure is fin portion temperature of the device.) recommended that the second reflow become at the device which is the temperature. (a) An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. The temperature of resin portion should be with in the temperature proffle below. (bl The temperature sloping when soldering-reflow is 4E/s or less. 240.X 200C 180C 25X, < 2 min > < 1 min ' 80s `i !+-iGiPd < SHARP CORPORATION (2) Dip soldering We recommend that solder dip should be 260F or less (Solder temp.) within and 1 time only. Please obey the note items below concerning solder reflow. (a) Atter solder dip, please do cooling (b) Please shall not give the mechanical naturally. stress or the impact conditions stress to the device. etc. in the actual application 10s In advance, please confirm fully the dip soldering in order to avoid any soldering bridge. (3) Hand soldering This device is basically designed for the soldering such as reflow soldering or dip soldering. In case when hand soldering is reluctantly needed for m-cation etc., it is recommended that only one hand soldering should be done at 26O'c or less of soldering iron edge temperature, for 10s or less. Please be careful not to touch soldering iron edge to leads directly etc. in order not to give any stress to the leads. Even within the above conditfons regarding solder reflow, solder dip or hand soldering there is the possibility that the stress given to the terminals by the deformation of PCB makes the wire in the device package cut. In advance, please con&m fully at the actual application. 7.5 For cleaning (1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 mm or less : The effect to device byL ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time. PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn`t occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol, Isopropyl . alcohol (2) Ultrasonic cleaning (3) Applicable solvent i In case when the other solvent is used, there are cases'& p the packaging resin is eroded. Please use the other solvent . after thorough con&nation is performed in actual using condition. |
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